JPH0220041A - 半導体ウエハの係合方法および装置 - Google Patents

半導体ウエハの係合方法および装置

Info

Publication number
JPH0220041A
JPH0220041A JP1121673A JP12167389A JPH0220041A JP H0220041 A JPH0220041 A JP H0220041A JP 1121673 A JP1121673 A JP 1121673A JP 12167389 A JP12167389 A JP 12167389A JP H0220041 A JPH0220041 A JP H0220041A
Authority
JP
Japan
Prior art keywords
wafer
jaw
arm
jaws
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1121673A
Other languages
English (en)
Japanese (ja)
Inventor
Jan I Ben
ジャン　アイ　ベン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of JPH0220041A publication Critical patent/JPH0220041A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1121673A 1988-05-25 1989-05-17 半導体ウエハの係合方法および装置 Pending JPH0220041A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US198347 1988-05-25
US07/198,347 US4900214A (en) 1988-05-25 1988-05-25 Method and apparatus for transporting semiconductor wafers

Publications (1)

Publication Number Publication Date
JPH0220041A true JPH0220041A (ja) 1990-01-23

Family

ID=22733007

Family Applications (2)

Application Number Title Priority Date Filing Date
JP1121673A Pending JPH0220041A (ja) 1988-05-25 1989-05-17 半導体ウエハの係合方法および装置
JP1990111168U Pending JPH0371641U (en]) 1988-05-25 1990-10-25

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP1990111168U Pending JPH0371641U (en]) 1988-05-25 1990-10-25

Country Status (2)

Country Link
US (1) US4900214A (en])
JP (2) JPH0220041A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235154A (ja) * 1992-02-24 1993-09-10 Mitsubishi Electric Corp ウエハ把持装置
JP2000343475A (ja) * 1999-04-01 2000-12-12 Applied Materials Inc ウェーハハンドリングロボット用の空気圧作動式撓みグリッパ

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CH680275A5 (en]) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
US5590996A (en) * 1994-10-13 1997-01-07 Semitherm Wafer transfer apparatus
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US5980187A (en) * 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
JP2002531942A (ja) 1998-12-02 2002-09-24 ニューポート・コーポレーション 試料を保持するロボットアーム端部エフェクタ
US6454332B1 (en) * 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
US6164899A (en) * 1999-04-22 2000-12-26 Automated Concepts, Inc. Disk transfer apparatus
WO2000066480A2 (en) * 1999-05-04 2000-11-09 Ade Corporation Edge gripping end effector wafer handling apparatus
US6357996B2 (en) 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
US6513848B1 (en) * 1999-09-17 2003-02-04 Applied Materials, Inc. Hydraulically actuated wafer clamp
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
US7256375B2 (en) * 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
US7654596B2 (en) 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US7749196B2 (en) * 2003-07-02 2010-07-06 Cook Incorporated Small gauge needle catheterization apparatus
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US20050110287A1 (en) * 2003-10-24 2005-05-26 Ade Corporation 200 MM notched/flatted wafer edge gripping end effector
JP3909770B2 (ja) * 2004-03-29 2007-04-25 川崎重工業株式会社 基板把持装置
US20060065634A1 (en) * 2004-09-17 2006-03-30 Van Den Berg Jannes R Low temperature susceptor cleaning
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP2013198960A (ja) * 2012-03-26 2013-10-03 Disco Corp ロボットハンド
CN109461693B (zh) 2017-09-06 2023-06-02 台湾积体电路制造股份有限公司 晶片传送装置、晶片处理系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226287A (ja) * 1985-03-07 1986-10-08 エプシロン　テクノロジー　インコーポレーテツド 加工品を取扱うたぬの装置および方法

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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226287A (ja) * 1985-03-07 1986-10-08 エプシロン　テクノロジー　インコーポレーテツド 加工品を取扱うたぬの装置および方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235154A (ja) * 1992-02-24 1993-09-10 Mitsubishi Electric Corp ウエハ把持装置
JP2000343475A (ja) * 1999-04-01 2000-12-12 Applied Materials Inc ウェーハハンドリングロボット用の空気圧作動式撓みグリッパ

Also Published As

Publication number Publication date
JPH0371641U (en]) 1991-07-19
US4900214A (en) 1990-02-13

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